Unsurpassable combination of precision, speed and flexibility
FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range.
Universal Instruments’ FuzionSC™ Platform offers a complete solution to flip chip package applications by blending the strict accuracy demands of Semiconductor assembly with the speed and robustness of Universal’s Fuzion Platform.
With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.
Highlights
- Broadest range of feeding platforms
- Low-maintenance, accurate over time
Features
- Silicon/SMT, high-accuracy/high-speed assembly
- High accuracy: (±10µm, < 3µm placement repeatability)
- Dual- or single-beam, multiple-spindle heads
- Full range of die and component types and sizes
- Versatile substrate handling
- Vision robustness recognition of pins or logic pads
- Stacking support (POP)
- Low-force capability